Technical Program Committee




Domestic Technical Committee

Aiping Zhou, Taizhou University, China
Benjamin Ng, Macao Polytechnic Institute, China
Bo Zheng, Air Force Engineering University, China
Chen Xu, North China Electric Power University, China
Congyi Zhu, Nanjing University, China
Defu Jiang, Hohai university, China
Deqiang He, Guangxi University, China
Dianxiong Liu, Institute of Systems Engineering, China
Ding Xu, Nanjing University of Posts and Telecommunications, China
Dong Yang, Beijing Jiaotong University, China
Dong Yin, National University of Defense Technology, China
Enji Sun, China Academy of Safety Science and Technology (CASST), China
Falin Liu, University of Science and Technology of China, China
Fu Chen, Central University of Finance and Economics, China
Hongmei Zhang, Guilin University of Electronic Technology, China
Hua HAN, Shanghai University of Engineering Science, China
Hua Wang, Beijing Institute of Technology, China
Hui LI, Xidian University, China
Hui Zhang, Nankai University, China
Huifang Chen, Zhejiang University, China
huijun Dai, Xi'an Jiaotong University, China
Jiagui Wu, Southwest University, China
Jian Yuan, Qilu University of Technology, China
Jianbin Gao, University of Electronic Science and Technology of China, China
Jie, Nanjing Institute of Technologh, China
jin ye, guangxi university, china
Jing Tian, Nanjing University, China
Jingjing Shi, Northeastern University, China
Jingwei Chen, CIGIT, CAS, China
kexin zhang, Changzhou college of information technology, China
Lei Deng, Shenzhen University, China
Li Guo, Beijing University of Posts and Telecommunications, China
Lidong Zhu, University of Electronic Science and Technology of China, China
Lijun Zhang, CETC 30, China
Lin Zheng, Guilin University of Electronic Technology, China
Lina Zhu, Xidian University, China
Liqun Hou, North China Electric Power University, China
Meng Sun, Army Engineering University, China
Peng Chen, University of Electronic Science and Technology of China, China
Ping Su, Tsinghua Shenzhen Internatioanl Graduate School, Tsinghua University, China
Qi Zhang, China Academy of Engineering Physics, China
Qiang Yang, Zhejiang University, China
Qing-an Ding, ShanDong University of Science and technology, china
Runzhi Li, Zhengzhou University, China
Shaoshuai Gao, University of Chinese Academy of Sciences, China
Shuai Liu, Hunan Normal University, China
Shunwai Zhang, Nanjing University of Posts and Telecommunications, China
Siyuan Zhou, Hohai University, China
Tao Liu, China University of Petroleum, China
Taoshen Li, Guangxi University, China
Wei Cheng, Northwestern Polytechnical University, China
Wei Feng, Tsinghua University, China
Wei Wei, Xi'an university of technology, China
Wenjun Xu, Beijing University of Posts and Telecommunications, China
Xianhua Dai, Sun Yat-sen University, Guangzhou
Xiaoqiang Hua, National University of Defense Technology, China
Xingcheng Liu, Sun Yat-sen University, China
Xu Zhang, Beijing University of Posts and Telecommunications, China
Xuewang Zhang, Chongqing University of Posts and Telecommunications, China
xuzhuojun, JiLin University, China
Yafeng Zhan, Tsinghua University, China
Ya-Xian Fan, GuiLin University of Electronics Technology, China
Yiyang Ni, Nanjing University of posts and telecommunications, China
Yonghua Wang, Guangdong University of Technology, China
Yongqiang Gao, Inner Mongolia University, China
Yuan Gao, Tsinghua University, china
Yuan Guoping, Ceyear Technologies Co., Ltd, CHINA
Yubing Zhang, Beijing Smart-Chip Microelectronics Technology, China
Yujin Zhang, Shanghai University of Engineering Science, China
YuLao Han, Pan Zhi Hua Unversity, China
Zhaoyong Fan, Nanchang Institute of Science & Technology, China
Zhenwen GUi, China electronic and technical corporation, China
Zhihua Wu, Liming Vocational University, China
Zhiping Shi, University of Electronic Science and Technology of China, China
Zhiyong Qiu, Inspur Electronic Information Industry Co.,Ltd, China
Zhu Tang, National University of Defense Technology, China



International Technical Committee

Akharin Khunkitti, King Mongkut's Institute of Technology Ladkrabang, Thailand
B.Kishore, Mahalingam College of Engineering and Technology. India
Belal Amro, Hebron University, Palestine
Bernd Wolfinger, University of Hamburg, Germany
Check Yee Law, Multimedia University, Malaysia
Gagandeep Kaur, Panjab University, India
H. M. Sun, National Tsing Hua University, Taiwan
Hamed Al-Raweshidy, Brunel University-Uxbridge, UK
Israa T. Aziz, University of Mosul, Iraq
Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
Kah Ong Michael Goh, Multimedia University, Malaysia
Kavita Jhajharia, Manipal University Jaipur, India
Lawrence Wong, National University of Singapore, Singapore
Manik Sharma, DAV University, India
Maurizio Bozzi, University of Pavia, Italy
Mohammed Abdel-Hafez, United Arab Emirates University, UAE
Mohd Nazri Ismail, Universiti Pertahanan Nasional Malaysia, Malaysia
Muhammad Naufal Bin Mansor, Universiti Malaysia Perlis (UniMAP), Malaysia
P.Varalakshmi, Anna University, India
Pascal Lorenz, University of Haute Alsace, France
Rinku Basak, American International University-Bangladesh, Bangladesh
Rohit Raja, Shri Shankaracharya Groups of Institutions, India
S. H. Shah Newaz, Universiti Teknologi Brunei, Brunei Darussalam
Srikanth Kamath, MAHE, India
Sunil Maharaj, University of Pretoria, South Africa
Tzung-Shi Chen, National University of Tainan, Taiwan
Wai Lok Woo, Northumbria University, UK
Yong Wee Sek, Universiti Teknikal Malaysia Melaka, Malaysia